2025

Alsulami, Bashayer Nafe, Harwell, Jonathon, Zante, Guillaume, Abbott, Andrew P., Feeney, Andrew ORCID: https://orcid.org/0000-0001-7170-1830 and Kettle, Jeff (2025) Hybrid delamination of silver contacts from c-Si solar cells: a low environmental impact recycling approach. Resources, Conservation and Recycling, 221, 108429. (doi: 10.1016/j.resconrec.2025.108429)

Kettle, J., Mukherjee, R. ORCID: https://orcid.org/0000-0002-7307-3599, Zhang, S., Harwell, J., Bainbridge, A., Wagih, M. ORCID: https://orcid.org/0000-0002-7806-4333, Martinez Diez, A., Menendez Suarez, M. Fe and Sanchez, P. (2025) Towards an Internet of Things circular economy using printed circuits on reusable steel substrates. Advanced Electronic Materials, (Submitted)

2024

Zhang, Tianwei, Bainbridge, Andrew, Harwell, Jonathon, Zhang, Shoushou, Wagih, Mahmoud ORCID: https://orcid.org/0000-0002-7806-4333 and Kettle, Jeff (2024) Life cycle assessment (LCA) of circular consumer electronics based on IC recycling and emerging PCB assembly materials. Scientific Reports, 14, 29183. (doi: 10.1038/s41598-024-79732-1) (PMID:39587208) (PMCID:PMC11589699)

Articles

Alsulami, Bashayer Nafe, Harwell, Jonathon, Zante, Guillaume, Abbott, Andrew P., Feeney, Andrew ORCID: https://orcid.org/0000-0001-7170-1830 and Kettle, Jeff (2025) Hybrid delamination of silver contacts from c-Si solar cells: a low environmental impact recycling approach. Resources, Conservation and Recycling, 221, 108429. (doi: 10.1016/j.resconrec.2025.108429)

Kettle, J., Mukherjee, R. ORCID: https://orcid.org/0000-0002-7307-3599, Zhang, S., Harwell, J., Bainbridge, A., Wagih, M. ORCID: https://orcid.org/0000-0002-7806-4333, Martinez Diez, A., Menendez Suarez, M. Fe and Sanchez, P. (2025) Towards an Internet of Things circular economy using printed circuits on reusable steel substrates. Advanced Electronic Materials, (Submitted)

Zhang, Tianwei, Bainbridge, Andrew, Harwell, Jonathon, Zhang, Shoushou, Wagih, Mahmoud ORCID: https://orcid.org/0000-0002-7806-4333 and Kettle, Jeff (2024) Life cycle assessment (LCA) of circular consumer electronics based on IC recycling and emerging PCB assembly materials. Scientific Reports, 14, 29183. (doi: 10.1038/s41598-024-79732-1) (PMID:39587208) (PMCID:PMC11589699)