Ravinder Dahiya - flexible electronics and robotics

Ravinder Dahiya holds an EPSRC Research Fellowship in flexible and printed electronics. Largely driven by material scientists, research in this area has focussed on the materials and fabrication techniques. Whilst these are important areas, the electronics engineering perspective including device modelling and circuit design is critical for taking the research closer to manufacturing.

High-mobility is not the only factor contributing to the high-performance of electronics on flexible substrates. Other parameters, such as ohmic contacts, high-k dielectric, and channel length etc., also affect the speed of electronics. Further, the acceptable degree of bendability for reliable operation of flexible electronics is a question that has not been addressed so far. Ravinder's research aims to address these challenges by printing silicon based electronics and sensors on ultra-flexible substrates. He will also systematically characterise the ultra-thin chips, identifying various parameters that change with bending, and suggest improved models for devices over bendable substrates.

Ravinder says "My research style is to enhance understanding of the fundamental issues, on one hand, with an orientation towards application on the other – basically, orienting science and technology towards bringing solutions to the society". His vision is to develop high-performance and cost-effective electronics and sensing systems on flexible substrates to enable tools such as electronic skin (also known as tactile skin, smart skin) that are of burgeoning interest in applications such as robotics, prosthetics, healthcare and surgical instrumentation.

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First published: 26 March 2015