Mr Mitradip Bhattacharjee

  • Research Assistant (Electronic & Nanoscale Engineering)

Publications

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Jump to: 2019
Number of items: 4.

2019

Bhattacharjee, M. , Soni, M. and Dahiya, R. (2019) Microchannel Based Flexible Dynamic Strain Sensor. In: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, UK, 08-10 Jul 2019, ISBN 9781538693049 (doi:10.1109/FLEPS.2019.8792317)

Bhattacharjee, M. , Vilouras, A. and Dahiya, R. (2019) Microdroplet Based Organic Vapour Sensor on a Disposable GO-Chitosan Flexible Substrate. In: IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019), Glasgow, UK, 7-10 July 2019, ISBN 9781538693049 (doi:10.1109/FLEPS.2019.8792237)

Nassar, H., Pullanchiyodan, A., Bhattacharjee, M. and Dahiya, R. (2019) 3D Printed Interconnects on Bendable Substrates for 3D Circuits. In: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, UK, 08-10 Jul 2019, ISBN 9781538693049 (doi:10.1109/FLEPS.2019.8792234)

Soni, M. , Bhattacharjee, M. , Manjakkal, L. and Dahiya, R. (2019) Printed Temperature Sensor Based on Graphene Oxide/PEDOT:PSS. In: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, UK, 08-10 Jul 2019, ISBN 9781538693049 (doi:10.1109/FLEPS.2019.8792268)

This list was generated on Fri Nov 22 14:51:14 2019 GMT.
Number of items: 4.

Conference Proceedings

Bhattacharjee, M. , Soni, M. and Dahiya, R. (2019) Microchannel Based Flexible Dynamic Strain Sensor. In: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, UK, 08-10 Jul 2019, ISBN 9781538693049 (doi:10.1109/FLEPS.2019.8792317)

Bhattacharjee, M. , Vilouras, A. and Dahiya, R. (2019) Microdroplet Based Organic Vapour Sensor on a Disposable GO-Chitosan Flexible Substrate. In: IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019), Glasgow, UK, 7-10 July 2019, ISBN 9781538693049 (doi:10.1109/FLEPS.2019.8792237)

Nassar, H., Pullanchiyodan, A., Bhattacharjee, M. and Dahiya, R. (2019) 3D Printed Interconnects on Bendable Substrates for 3D Circuits. In: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, UK, 08-10 Jul 2019, ISBN 9781538693049 (doi:10.1109/FLEPS.2019.8792234)

Soni, M. , Bhattacharjee, M. , Manjakkal, L. and Dahiya, R. (2019) Printed Temperature Sensor Based on Graphene Oxide/PEDOT:PSS. In: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, UK, 08-10 Jul 2019, ISBN 9781538693049 (doi:10.1109/FLEPS.2019.8792268)

This list was generated on Fri Nov 22 14:51:14 2019 GMT.