Mr Habib Nassar

  • Demonstrator (School of Engineering)

Publications

List by: Type | Date

Jump to: 2021 | 2020 | 2019 | 2018
Number of items: 5.

2021

Ozioko, O., Nassar, H. and Dahiya, R. (2021) 3D printed interdigitated capacitor based tilt sensor. IEEE Sensors Journal, (doi: 10.1109/JSEN.2021.3058949) (Early Online Publication)

2020

Christou, A., Gao, Y., Navaraj, W. T., Nassar, H. and Dahiya, R. (2020) 3D touch surface for interactive pseudo-holographic displays. Advanced Intelligent Systems, (doi: 10.1002/aisy.202000126) (Early Online Publication)

Ntagios, M. , Nassar, H., Pullanchiyodan, A., Navaraj, W. T. and Dahiya, R. (2020) Robotic hands with intrinsic tactile sensing via 3D printed soft pressure sensors. Advanced Intelligent Systems, 2(6), 1900080. (doi: 10.1002/aisy.201900080)

2019

Nassar, H., Pullanchiyodan, A., Bhattacharjee, M. and Dahiya, R. (2019) 3D Printed Interconnects on Bendable Substrates for 3D Circuits. In: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, UK, 08-10 Jul 2019, ISBN 9781538693049 (doi:10.1109/FLEPS.2019.8792234)

2018

Nassar, H., Ntagios, M. , Navaraj, W. T. and Dahiya, R. (2018) Multi-Material 3D Printed Bendable Smart Sensing Structures. In: 2018 IEEE Sensors, New Delhi, India, 28-31 Oct 2018, ISBN 9781538647073 (doi:10.1109/ICSENS.2018.8589625)

This list was generated on Thu Mar 4 15:58:47 2021 GMT.
Number of items: 5.

Articles

Ozioko, O., Nassar, H. and Dahiya, R. (2021) 3D printed interdigitated capacitor based tilt sensor. IEEE Sensors Journal, (doi: 10.1109/JSEN.2021.3058949) (Early Online Publication)

Christou, A., Gao, Y., Navaraj, W. T., Nassar, H. and Dahiya, R. (2020) 3D touch surface for interactive pseudo-holographic displays. Advanced Intelligent Systems, (doi: 10.1002/aisy.202000126) (Early Online Publication)

Ntagios, M. , Nassar, H., Pullanchiyodan, A., Navaraj, W. T. and Dahiya, R. (2020) Robotic hands with intrinsic tactile sensing via 3D printed soft pressure sensors. Advanced Intelligent Systems, 2(6), 1900080. (doi: 10.1002/aisy.201900080)

Conference Proceedings

Nassar, H., Pullanchiyodan, A., Bhattacharjee, M. and Dahiya, R. (2019) 3D Printed Interconnects on Bendable Substrates for 3D Circuits. In: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, UK, 08-10 Jul 2019, ISBN 9781538693049 (doi:10.1109/FLEPS.2019.8792234)

Nassar, H., Ntagios, M. , Navaraj, W. T. and Dahiya, R. (2018) Multi-Material 3D Printed Bendable Smart Sensing Structures. In: 2018 IEEE Sensors, New Delhi, India, 28-31 Oct 2018, ISBN 9781538647073 (doi:10.1109/ICSENS.2018.8589625)

This list was generated on Thu Mar 4 15:58:47 2021 GMT.