Mr Habib Nassar

  • Demonstrator (School of Engineering)

Publications

List by: Type | Date

Jump to: 2019 | 2018
Number of items: 3.

2019

Ntagios, M. , Nassar, H., Pullanchiyodan, A., Navaraj, W. T. and Dahiya, R. (2019) Robotic hands with intrinsic tactile sensing via 3D printed soft pressure sensors. Advanced Intelligent Systems, (Accepted for Publication)

Nassar, H., Pullanchiyodan, A., Bhattacharjee, M. and Dahiya, R. (2019) 3D Printed Interconnects on Bendable Substrates for 3D Circuits. In: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, UK, 08-10 Jul 2019, ISBN 9781538693049 (doi:10.1109/FLEPS.2019.8792234)

2018

Nassar, H., Ntagios, M. , Navaraj, W. T. and Dahiya, R. (2018) Multi-Material 3D Printed Bendable Smart Sensing Structures. In: 2018 IEEE Sensors, New Delhi, India, 28-31 Oct 2018, ISBN 9781538647073 (doi:10.1109/ICSENS.2018.8589625)

This list was generated on Sat Feb 22 20:38:36 2020 GMT.
Jump to: Articles | Conference Proceedings
Number of items: 3.

Articles

Ntagios, M. , Nassar, H., Pullanchiyodan, A., Navaraj, W. T. and Dahiya, R. (2019) Robotic hands with intrinsic tactile sensing via 3D printed soft pressure sensors. Advanced Intelligent Systems, (Accepted for Publication)

Conference Proceedings

Nassar, H., Pullanchiyodan, A., Bhattacharjee, M. and Dahiya, R. (2019) 3D Printed Interconnects on Bendable Substrates for 3D Circuits. In: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Glasgow, UK, 08-10 Jul 2019, ISBN 9781538693049 (doi:10.1109/FLEPS.2019.8792234)

Nassar, H., Ntagios, M. , Navaraj, W. T. and Dahiya, R. (2018) Multi-Material 3D Printed Bendable Smart Sensing Structures. In: 2018 IEEE Sensors, New Delhi, India, 28-31 Oct 2018, ISBN 9781538647073 (doi:10.1109/ICSENS.2018.8589625)

This list was generated on Sat Feb 22 20:38:36 2020 GMT.